| Category | Description | Sym. | Capability |
|---|---|---|---|
1. Microvia Diameter |
1.1 Microvia Diameter at Target Land |
A | 100 um 0.004" |
| 1.2 Microvia Diameter at Capture Land |
B | 125 um 0.005" |
|
| 1.3 Microvia Target Land Size |
C | 0.012" | |
| 1.4 Microvia Target Land Size |
D | 450 um 0.0177" |
|
2. Stagger & Stack |
2.1 Min. Staggered Via Pitch Staggered Via Pitch |
A | 560 um 0.022" |
| 2.2 RCC Thickness RCC |
B | 50 um 0.002" |
|
| 2.3 Blind Via Layers |
N | 2 | |
3. Material & Construction |
3.1 Finished Board Thickness |
H | 0.012" – 0.250" |
| 3.2 Min. Inner Layer Thickness |
H1 | 0.075 mm 0.003" |
|
| 3.3 Min. Dielectric Thickness |
H2 | 0.05 mm 0.002" |
|
| 3.4 Max. Inner Layer Copper |
T1 | 6 oz | |
| 3.5 Max. Outer Layer Copper |
T2 | 6 oz | |
4. Warp |
4.1 Warp & Twist (Max.) |
A B | < 0.75% |
5. Pad |
5.1 Min. Finish Hole Size |
H | 0.005" |
| 5.2 Min. Land Size |
H | 0.018" | |
| 5.3 Min. Annual Ring for Via |
R1 | IPC Class 2 | |
| 5.4 Min. Annual Ring for Component |
R1 | 0.05 mm 0.002", provided designed per IPC |
|
6. Drill |
6.1 Tolerance for PTH Hole |
A | 0.08 mm 0.003" |
| 6.2 NPTH Hole Tolerance |
B | 0.05 mm 0.002" |
|
7. Registration for S/M |
7.1 Registration for S/M to Pattern |
S1-S2 | 0.0024" |
| 7.2 Registration for Legend to S/M |
NA | 0.005" | |
8. Registration for Drill |
8.1 Registration for Drill to Inner Layer |
S | 0.075 mm 0.003" |
| 8.2 Registration for Drill to Datum |
S | 0.05 mm 0.002" |
|
| 8.3 Registration for First Drill to Second Drill |
NA | 0.005" | |
9. Registration for Layers |
9.1 Layer to Layer for 4 layers |
S | 0.08 mm 0.003" |
| 9.2 Layer to Layer for 6 layers |
S | 0.10 mm 0.004" |
|
| 9.3 Layer to Layer for 8 layers |
S | 0.13 mm 0.005" |
|
10. Line Width |
10.1 I/L Min. Width (0.5 oz) |
W2 | 0.003" |
| 10.2 O/L Min. Width (0.5 oz) |
W1 | 0.003" | |
11. Line Space |
11.1 I/L Min. Space |
S2 | 0.003" |
| 11.2 O/L Min. Space (0.5 oz) |
S | 0.003" | |
12. Drill Capability |
12.1 Max. Aspect Ratio (Board Thickness 0.063") |
H/T | 12.0 |
| 12.2 Min. Drill Hole Size (Board Thickness 0.063", After Plating) |
H | 0.0083 | |
13. S/M Thickness |
13.1 Max. Thickness on Copper |
H1 | 0.025 mm 0.001" |
| 13.2 Max. Thickness at Shoulder |
H2 | 0.0075 mm 0.0003" |
|
14. S/M Capability |
14.1 Min. SMD Space for Dam |
W2 | 0.0078" |
| 14.2 Min. Dam Size |
W1 | 0.0004" 0.0005" for white and black colors |
|
15. Carbon Capability |
15.1 Max. Contact Resistance |
NA | 30 Ω / sq |
| 15.2 Max. Primary Resistance |
NA | 30 Ω | |
| 15.3 Min. Thickness |
NA | 0.0004" | |
| 15.4 Min. Space |
A | 0.015" | |
| 15.5 Max. Space for Registration |
B | 0.007" | |
16. HAL Capability |
16.1 Min. PCB Thickness for HAL |
H2 | 0.6 mm 0.0236" |
| 16.2 Min. Pad Width/Space for HAL |
W | 0.25 mm 0.0098" |
|
| 16.3 HAL Thickness for any point |
H1 | 0.001 mm ~ 0.025 mm 40micro-inch ~0.001" |
|
| 16.4 Thickness on QFP Pad (0.05" Wide Quad) |
A | 0.015 mm ~ 0.030 mm 0.0006" ~0.0012" |
|
17. HAL Capability |
17.1 Outline Tolerance-Punching |
AB | NA |
| 17.2 Outline Tolerance-Routing |
AB | 0.005" | |
18. Beveling Capability |
18.1 Beveling Angle |
B | 200-600 |
| 18.2 Tolerance for Outline of Bevel |
A | + - 0.005" | |
19. V-Cut Capability |
19.1 V-Cut Angle V-Cut |
C | 30° |
| 19.2 Range of Board Thickness |
H | 0.030"~0.125" | |
| 19.3 Tolerance of V-Cut Residual |
B | 0.05 mm 0.003" |
|
| 19.4 V-Cut Off Line V-Cut |
D | 0.125 mm 0.005" |
|
20. Test Capability |
20.1 Voltage |
NA | 5 –500 VDC |
| 20.2 Isolation |
NA | 500 MΩ | |
| 20.3 Continuity |
NA | 20Ω~100KΩ | |
| 20.4 Min. SMD PAD Pitch SMD |
P | 0.3 mm 0.0118" |
|
21. Impedance Control Capability |
21.1 Impedance Control > 50O |
NA | +/- 10% |
| 21.2 Impedance Control < 50O |
NA | +/- 10% | |
22. Differential Impedance Capability |
22.1 Differential Impedance Control > 50O |
NA | +/- 10% |
| 22.2 Differential Impedance Control < 50O |
NA | +/- 10% | |
| 23. Coplanar Impedance Capability |
22.1 Coplanar Impedance Control > 50O |
NA | +/- 10% |
| 22.2 Coplanar Impedance Control < 50O |
NA | +/- 10% |